Spring 2025

The MouthPad^: a high-bandwidth intra-oral computer interface

Suraj Gowda, Augumental

Transceivers for Optical Communications in the Age of AI

Ray Nguyen, Marvell

Shaping the Future with Electromagnetics: From Intelligent Sensing to Automated Design

Constantine Sideris, University of Southern California

Package Design and Chiplet’s/Silicon Photonics and Automated Active Alignment

Dhiraj Bora & Suresh Subramaniam, Silitronics

DiffuserCam: Multi-dimensional Lensless Imaging

Laura Waller, UC Berkeley

Building the Metaverse: Augmented Reality applications and integrated circuits challenges

Edith Beigné, Meta

A 384-Site Chip Platform for Biochemical Applications with Individual Site Precision Temperature Control

Michael Coln, Analog Devices

Integrated Sensing and Communication for 6G

Mike Millhaem, Keysight

2×2 MIMO 802.11a/b/g/n/ac Simultaneous Dual-Band and 802.11ax Triple-Band WLAN Transceivers with up to +29 dBm Psat Integrated Power Amplifiers

Julian Tham, Infineon

Catalyzing Computing for Brain-Computer Interfaces

Abhishek Bhattacharjee, Yale University

Friday Seminar Presentations